Encapsulation Technologies for Electronic Applications - Materials and Processes for Electronic Applications - Ardebili, Haleh (Department of Mechanical Engineering, University of Houston, USA and visiting scholar, Mechanical Engineering and Materials Science Department, Rice University) - Books - William Andrew Publishing - 9780128119785 - October 11, 2018
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Encapsulation Technologies for Electronic Applications - Materials and Processes for Electronic Applications 2nd edition

Ardebili, Haleh (Department of Mechanical Engineering, University of Houston, USA and visiting scholar, Mechanical Engineering and Materials Science Department, Rice University)

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Encapsulation Technologies for Electronic Applications - Materials and Processes for Electronic Applications 2nd edition

498 pages

Media Books     Paperback Book   (Book with soft cover and glued back)
Released October 11, 2018
ISBN13 9780128119785
Publishers William Andrew Publishing
Pages 508
Dimensions 151 × 229 × 24 mm   ·   675 g
Series Editor Licari, James J. (AvanTeco, Whittier, CA, USA)

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