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Solder Joint Reliability: Theory and Applications 1991 edition
John H. Lau
Solder Joint Reliability: Theory and Applications 1991 edition
John H. Lau
New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them.
631 pages, 146 black & white illustrations, biography
Media | Books Hardcover Book (Book with hard spine and cover) |
Released | May 31, 1991 |
ISBN13 | 9780442002602 |
Publishers | Van Nostrand Reinhold Inc.,U.S. |
Pages | 631 |
Dimensions | 155 × 235 × 34 mm · 975 g |
Language | English |
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