RF and Microwave Microelectronics Packaging II - - Books - Springer International Publishing AG - 9783319847191 - June 9, 2018
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RF and Microwave Microelectronics Packaging II Softcover reprint of the original 1st ed. 2017 edition

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It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics.

172 pages, 130 Tables, color; 77 Illustrations, color; 50 Illustrations, black and white; XII, 172 p

Media Books     Paperback Book   (Book with soft cover and glued back)
Released June 9, 2018
ISBN13 9783319847191
Publishers Springer International Publishing AG
Pages 172
Dimensions 150 × 220 × 10 mm   ·   272 g
Language German  
Editor Kuang, Ken
Editor Sturdivant, Rick

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