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Mems / Moem Packaging: Concepts, Designs, Materials and Processes
K.b. Gilleo
Mems / Moem Packaging: Concepts, Designs, Materials and Processes
K.b. Gilleo
Examines the properties of the materials used in MEMS and MOEN assembly and evaluates them in terms of their routing, electrical performance, thermal management and reliability. This book discusses packaging methods such as: molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging.
220 pages, Illustrations
Media | Books Hardcover Book (Book with hard spine and cover) |
Released | August 1, 2005 |
ISBN13 | 9780071455565 |
Publishers | McGraw-Hill Education - Europe |
Pages | 220 |
Dimensions | 159 × 237 × 23 mm · 485 g |