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System on Package Ed edition
Rao Tummala
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System on Package Ed edition
Rao Tummala
"System-on-Package" (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. This book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this packaging technology can be used to solve pressing electronics design challenges.
785 pages, Illustrations
| Media | Books Hardcover Book (Book with hard spine and cover) |
| Released | April 1, 2007 |
| Original release date | 2008 |
| ISBN13 | 9780071459068 |
| Publishers | McGraw-Hill Education - Europe |
| Pages | 785 |
| Dimensions | 193 × 241 × 35 mm · 1.40 kg |
