Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore - Woodhead Publishing Series in Electronic and Optical Materials - Zhang, Hengyun (Shanghai University of Engineering Science, China) - Books - Elsevier Science & Technology - 9780081025321 - November 15, 2019
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Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore - Woodhead Publishing Series in Electronic and Optical Materials

Zhang, Hengyun (Shanghai University of Engineering Science, China)

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Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore - Woodhead Publishing Series in Electronic and Optical Materials

434 pages

Media Books     Paperback Book   (Book with soft cover and glued back)
Released November 15, 2019
ISBN13 9780081025321
Publishers Elsevier Science & Technology
Pages 434
Dimensions 229 × 153 × 30 mm   ·   698 g

See all of Zhang, Hengyun (Shanghai University of Engineering Science, China) ( e.g. Paperback Book )