The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.

382 pages, 49 Tables, black and white; 75 Illustrations, black and white

Media	Books Paperback Book (Book with soft cover and glued back)
To be released	October 4, 2024
ISBN13	9780367635886
Publishers	Taylor & Francis Ltd
Pages	382
Dimensions	574 g (Weight (estimated))

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