Solder Joint Technology: Materials, Properties, and Reliability - Springer Series in Materials Science - King-Ning Tu - Books - Springer-Verlag New York Inc. - 9780387388908 - August 22, 2007
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Solder Joint Technology: Materials, Properties, and Reliability - Springer Series in Materials Science 2007 edition

King-Ning Tu

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Solder Joint Technology: Materials, Properties, and Reliability - Springer Series in Materials Science 2007 edition

The European Union's directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders.


370 pages, biography

Media Books     Hardcover Book   (Book with hard spine and cover)
Released August 22, 2007
ISBN13 9780387388908
Publishers Springer-Verlag New York Inc.
Pages 370
Dimensions 156 × 235 × 23 mm   ·   662 g
Language English  

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