Thermal Design of Liquid Cooled Microelectronic Equipment - ASME Press Book Series on Electronic Packaging - Lian-Tuu Yeh - Books - American Society of Mechanical Engineers - 9780791861936 - January 30, 2020
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Thermal Design of Liquid Cooled Microelectronic Equipment - ASME Press Book Series on Electronic Packaging

Lian-Tuu Yeh

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Thermal Design of Liquid Cooled Microelectronic Equipment - ASME Press Book Series on Electronic Packaging

Focuses on providing practical solutions to thermal issues related to high power systems where liquid cooling is required. The book serves as a general thermal design guide for any liquid cooled systems with the main focus on microelectronic equipment that includes digital and/or analogue devices.

277 pages

Media Books     Hardcover Book   (Book with hard spine and cover)
Released January 30, 2020
ISBN13 9780791861936
Publishers American Society of Mechanical Engineers
Pages 277
Dimensions 237 × 160 × 24 mm   ·   602 g
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