Tell your friends about this item:
Design for High Performance, Low Power, and Reliable 3D Integrated Circuits 2013 edition
Sung Kyu Lim
Design for High Performance, Low Power, and Reliable 3D Integrated Circuits 2013 edition
Sung Kyu Lim
This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits.
560 pages, 167 black & white tables, biography
Media | Books Paperback Book (Book with soft cover and glued back) |
Released | December 16, 2014 |
Original release date | 2012 |
ISBN13 | 9781489986962 |
Publishers | Springer-Verlag New York Inc. |
Pages | 560 |
Dimensions | 155 × 235 × 30 mm · 816 g |
Language | English |