Three-Dimensional Molded Interconnect Devices (3D-MID): Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers - Jorg Franke - Books - Hanser Publications - 9781569905517 - April 30, 2014
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Three-Dimensional Molded Interconnect Devices (3D-MID): Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers

Jorg Franke

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Three-Dimensional Molded Interconnect Devices (3D-MID): Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers

Offers a comprehensive insight into the state of the art in 3D- molded interconnect device (MID) technology along the entire process chain. Individual chapters deal with systematics of targeted development of MID parts and explore, with a dozen and more successful series-production applications as examples, the widely diverse fields of application for MID technology.

356 pages

Media Books     Hardcover Book   (Book with hard spine and cover)
Released April 30, 2014
ISBN13 9781569905517
Publishers Hanser Publications
Pages 356
Dimensions 174 × 246 × 25 mm   ·   1 kg
Editor Franke, Jorg

See all of Jorg Franke ( e.g. Hardcover Book and Paperback Book )