High-bandwidth Memory Interface - Springerbriefs in Electrical and Computer Engineering - Chulwoo Kim - Books - Springer International Publishing AG - 9783319023809 - November 18, 2013
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High-bandwidth Memory Interface - Springerbriefs in Electrical and Computer Engineering 2014 edition

Chulwoo Kim

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High-bandwidth Memory Interface - Springerbriefs in Electrical and Computer Engineering 2014 edition

This book provides an overview of recent advances in memory interface design at both the architecture and circuit levels. Coverage includes signal integrity and testing, TSV interface, high-speed serial interface including equalization, ODT, pre-emphasis, wide I/O interface including crosstalk, skew cancellation, and clock generation and distribution. Trends for further bandwidth enhancement are also covered.

112 pages, 50 black & white illustrations, 41 colour illustrations, 8 black & white tables, 1 colour

Media Books     Paperback Book   (Book with soft cover and glued back)
Released November 18, 2013
ISBN13 9783319023809
Publishers Springer International Publishing AG
Pages 112
Dimensions 155 × 235 × 5 mm   ·   149 g
Language English  

See all of Chulwoo Kim ( e.g. Paperback Book )