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High-bandwidth Memory Interface - Springerbriefs in Electrical and Computer Engineering 2014 edition
Chulwoo Kim
High-bandwidth Memory Interface - Springerbriefs in Electrical and Computer Engineering 2014 edition
Chulwoo Kim
This book provides an overview of recent advances in memory interface design at both the architecture and circuit levels. Coverage includes signal integrity and testing, TSV interface, high-speed serial interface including equalization, ODT, pre-emphasis, wide I/O interface including crosstalk, skew cancellation, and clock generation and distribution. Trends for further bandwidth enhancement are also covered.
112 pages, 50 black & white illustrations, 41 colour illustrations, 8 black & white tables, 1 colour
Media | Books Paperback Book (Book with soft cover and glued back) |
Released | November 18, 2013 |
ISBN13 | 9783319023809 |
Publishers | Springer International Publishing AG |
Pages | 112 |
Dimensions | 155 × 235 × 5 mm · 149 g |
Language | English |
See all of Chulwoo Kim ( e.g. Paperback Book )