Tell your friends about this item:
Arbitrary Modeling of Tsvs for 3D Integrated Circuits - Analog Circuits and Signal Processing 2015 edition
Khaled Salah
Arbitrary Modeling of Tsvs for 3D Integrated Circuits - Analog Circuits and Signal Processing 2015 edition
Khaled Salah
This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.
271 pages, 60 black & white illustrations, 99 colour illustrations, 58 black & white tables, 5 colou
Media | Books Hardcover Book (Book with hard spine and cover) |
Released | September 5, 2014 |
ISBN13 | 9783319076102 |
Publishers | Springer International Publishing AG |
Pages | 271 |
Dimensions | 155 × 235 × 13 mm · 449 g |
Language | English |
See all of Khaled Salah ( e.g. Hardcover Book and Paperback Book )