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THERMAL MANAGEMENT OF MICROELECTRONIC EQUIPMENT (801683) - ASME Press Series on Electronic Packaging
Lian-tuu Yeh
THERMAL MANAGEMENT OF MICROELECTRONIC EQUIPMENT (801683) - ASME Press Series on Electronic Packaging
Lian-tuu Yeh
With this systematic examination of the factors that govern the thermal performance of electronics, the authors solve design problems encountered in developing and analysing very-high-performance and high-heat-dissipation devices, as well as intermediate and lower-power devices.
440 pages
Media | Books Paperback Book (Book with soft cover and glued back) |
Released | June 30, 2002 |
ISBN13 | 9780791801680 |
Publishers | American Society of Mechanical Engineers |
Pages | 440 |
Dimensions | 241 × 162 × 31 mm · 804 g |